ADVANCING HPC ARCHITECTURE: INTEGRATION OF SCALABLE INTERCONNECTS WITH ENERGY-EFFICIENT SYSTEM-ON-CHIP DESIGNS

Abstract

Modern High-Performance Computing (HPC) systems face increasing demands for computational power while confronting energy efficiency and scalability challenges. This article comprehensively analyzes two critical components in optimizing HPC performance: scalable interconnects and low-power System-on-Chip (SoC) design. The article examines recent advancements in custom interconnect technologies that enable efficient communication between processing elements, focusing on their impact on data transfer speeds and system latency. The article investigates heterogeneous computing approaches in SoC design, analyzing the integration of multiple processor types on a single chip, including CPUs, GPUs, and FPGAs. The article evaluates emerging packaging technologies, particularly 3D stacking, and chiplet designs, demonstrating their effectiveness in overcoming traditional scaling limitations. The findings indicate that the synergistic implementation of these technologies offers significant improvements in both computational performance and energy efficiency. The article contributes to understanding next-generation HPC system design by providing insights into the optimal balance between interconnect scalability and power-efficient SoC integration while addressing thermal management and manufacturing challenges.